Please use this identifier to cite or link to this item:
|Type:||Artigo de evento|
|Title:||Suspended Membranes Made By Silicon Nitride Deposited By Ecr-cvd|
|Abstract:||Nitride (SiNx) insulators have been deposited by low temperature (20°C) electron cyclotron resonance (ECR) plasma on Si substrates. Characterization by Fourier transform infra-red (FTIR) spectrometry analyses reveal the presence of Si-N, Si-H and N-H bonds in the silicon nitride films. The refractive indexes between 1.77 and 2.9 and the thickness between 300 nm and 460 nm were measured by ellipsometry. With these thickness values, the deposition rates of 13 to 16 nm/min, the BHF etch rates of 0.7 to 454 nm/min, and the KOH etch rates lower than 1 nm/min were determined. The nitrides, which presented high resistance to BHF and KOH etchings, were used to fabricate suspended membranes on Si substrates. Scanning Electron Microscopy (SEM) inspections were used to investigate the SiNx resistance to KOH etchings. The results indicated that formed SiNx films are suitable membranes for micro-electro-mechanical systems (MEMS).|
|Appears in Collections:||Unicamp - Artigos e Outros Documentos|
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.