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|Type:||Artigo de periódico|
|Title:||Grabado Anisotrópico De Silicio Para Aplicación En Micromaquinado Usando Plasmas De Sf6/ch4/o2/ar Y Sf6/cf4/o2/ar|
|Abstract:||We investigated the reactive ion etching of silicon using SF 6/CH4(CF4)/O2/Ar gas mixtures containing fluorine for MEMS applications. Etch rates and anisotropy of etch profiles were examined as a function of gas composition, material of electrode, and RF power. Etch depths were measured using a profilometer, and etch profiles were analyzed by scanning electron microscope. As a mask material, an aluminium film deposited by evaporation, was used. High anisotropy of etching of 0.95 was achieved at etch depths up to 20-30 micrometers and etch rates of approximately 0.3-0.6 μm/min. Highly anisotropic etching is based on a mechanism that enhance the ion bombarding and protects the sidewalls due to polymerization and/or oxidation mechanisms in order to avoid the lateral etch. However, under the anisotropic etching conditions, considerable damages of the etched surfaces (roughness formation), were observed. After etching experiments, wet / dry cleaning procedures were applied to remove surface residues resulting from the reactive ion etching and to improve the etched surface morphology.|
|Appears in Collections:||Unicamp - Artigos e Outros Documentos|
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