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|Type:||Artigo de evento|
|Title:||Silicon Oxide Sacrificial Layer For Mems Applications|
|Abstract:||Silicon oxide (SiO2) insulators have been deposited by electron cyclotron resonance (ECR) plasma on Si substrate at room temperature (20°C). Optical emission spectrometry (OES) was used for plasma characterization, and intense formation of OH molecules in the gas phase was detected. Chemical bonds of the SiO2 films were evaluated using Fourier Transform Infra- Red spectrometry (FTIR), which revealed the presence of Si-O, Si-Si and O-H bonds. The refractive indexes between 1.45 and 1.64 and the thickness between 326 nm and 506 nm were measured by ellipsometry. With these values, the deposition rates of 16 to 25 nm/min and the BHF etch rates higher than 1 μm/min were determined. The silicon oxide, which presented low resistance to BHF etching, were used as sacrificial layers for microelectro-mechanical systems (MEMS) applications. Scanning Electron Microscopy (SEM) inspection was used to investigate the suspended structures, which were formed using these oxides. The results indicated that formed SiO2 films are suitable sacrificial layers for MEMS.|
|Appears in Collections:||Unicamp - Artigos e Outros Documentos|
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