Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/91730
Type: Artigo de evento
Title: Integration Of Microfabricated Capacitive Bridge And Thermistor On The Alumina Substrates
Author: Costa J.S.
Flacker A.
Nakashima M.H.S.
Fruett F.
Zampieri M.
Longo E.
Abstract: This paper describes a thin film fabrication technique of planar metallic microstructure with geometries between 10 and 20μm on 96% alumina substrate. This technique integrates a microfabricated capacitive bridge and thermistor on the same substrate employing metal and vacuum deposition. The procedure showed good resolution using a substrate with medium grain size between 3-5μm and average peak to valley surface roughness (Ra) 0.1μm. The film adhesion was tested by soldering metallic wires on the capacitor electrodes. These structures can be used for thin film characterization. We also deposited an oxide thin film (TiO2:WO3) by using polymeric precursors method. © The Electrochemical Society.
Editor: 
Rights: fechado
Identifier DOI: 10.1149/04901.0451ecst
Address: http://www.scopus.com/inward/record.url?eid=2-s2.0-84875843371&partnerID=40&md5=558b5abbaa9224f58b7a06789786e2b1
Date Issue: 2009
Appears in Collections:Unicamp - Artigos e Outros Documentos

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