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|Type:||Artigo de evento|
|Title:||A New Fabrication Technique Of Planar Metallic Microstructures On Alumina Substrate|
|Abstract:||This paper describes a new fabrication technique of planar metallic microstructures with geometries equal or smaller than 15μm on 96% alumina substrates. This technique is based on both: chemical and electrolytic deposition. In order to evaluate this technique we design and fabricate a bridge of interdigited capacitors. The microscope inspection showed that the structures well reproduced the design of the masks. The adhesion of the film was tested by soldering metallic wires on the capacitor electrodes. The mean value and the standard deviation considering 16 capacitors with distance between interdigited electrodes of 15μm, fabricated in two runs, are 1,484pF and 0,053pF, respectively. The relative standard deviation amounts to 3,3%. © The Electrochemical Society.|
|Appears in Collections:||Unicamp - Artigos e Outros Documentos|
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