Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/87001
Type: Artigo de periódico
Title: Electrochemical Behavior Of A Lead-free Sn-cu Solder Alloy In Nacl Solution
Author: Osorio W.R.
Freitas E.S.
Spinelli J.E.
Garcia A.
Abstract: Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn-Cu alloy samples in a naturally aerated 0.5M NaCl solution at 25°C. It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (icorr) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on icorr is also discussed. © 2013 Elsevier Ltd.
Editor: 
Rights: fechado
Identifier DOI: 10.1016/j.corsci.2013.11.010
Address: http://www.scopus.com/inward/record.url?eid=2-s2.0-84891628262&partnerID=40&md5=3ff1ea1e8b56d97663cc08c0178a1624
Date Issue: 2014
Appears in Collections:Unicamp - Artigos e Outros Documentos

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