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Type: Artigo de periódico
Title: Overlap optimization in semiconductor waveguides by wafer bonding
Author: Munoz, M
Patel, NB
Abstract: In this work, we show that the use of a wafer-bonding technique, wherein an inverted half-waveguide structure is bonded on the upright half to form a complete waveguide, optimizes the overlap factor present in three-wave parametric interactions realized in (4) over bar 3m semiconductor waveguides. These optimized waveguides can be used for efficient frequency-mixing devices which detect or emit infrared light.
Subject: parametric interactions
semiconductor waveguides
Country: EUA
Editor: Ieee-inst Electrical Electronics Engineers Inc
Rights: fechado
Identifier DOI: 10.1109/JQE.2003.810772
Date Issue: 2003
Appears in Collections:Unicamp - Artigos e Outros Documentos

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