Please use this identifier to cite or link to this item:
|Type:||Artigo de periódico|
|Title:||Overlap optimization in semiconductor waveguides by wafer bonding|
|Abstract:||In this work, we show that the use of a wafer-bonding technique, wherein an inverted half-waveguide structure is bonded on the upright half to form a complete waveguide, optimizes the overlap factor present in three-wave parametric interactions realized in (4) over bar 3m semiconductor waveguides. These optimized waveguides can be used for efficient frequency-mixing devices which detect or emit infrared light.|
|Editor:||Ieee-inst Electrical Electronics Engineers Inc|
|Appears in Collections:||Unicamp - Artigos e Outros Documentos|
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