Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/81369
Type: Artigo de periódico
Title: Macrosegregation and microstructure dendritic array affecting the electrochemical behaviour of ternary Al-Cu-Si alloys
Author: Osorio, WR
Moutinho, DJ
Peixoto, LC
Ferreira, IL
Garcia, A
Abstract: The aim of the present study is to evaluate the electrochemical corrosion behaviour of ternary as-cast Al-Cu-Si alloys. Electrochemical impedance spectroscopy (EIS), potentiodynamic anodic polarization techniques and an equivalent circuit analysis were used to evaluate the corrosion resistance in a 0.5 M NaCl solution at 25 degrees C. It was found that silicon and copper contents, which are affected by position in casting due to macrosegregation, and the dendrite arm spacing, can play an interdependent role on the corrosion behaviour. For the region with predominant Cu inverse segregation, i.e., close to the casting surface, the Cu content is the driving-force leading to a decrease in the corrosion resistance, but the favorable effect of the fineness of the dendritic array has also to be taken into account. However, from secondary dendrite arm spacings of about 15 mu m up to coarser dendritic arrays, the Si particles seem to be the driving-forces related to the corrosion resistance and for these cases coarser microstructures were shown to improve the corrosion resistance. (C) 2011 Elsevier Ltd. All rights reserved.
Subject: Al-Cu-Si alloys
Macrosegregation
Microstructure
Electrochemical impedance spectroscopy
Country: Inglaterra
Editor: Pergamon-elsevier Science Ltd
Rights: fechado
Identifier DOI: 10.1016/j.electacta.2011.07.028
Date Issue: 2011
Appears in Collections:Unicamp - Artigos e Outros Documentos

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