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Type: Artigo de periódico
Title: The influence of chitosans with defined degrees of acetylation on the thermodynamic data for copper coordination
Author: Monteiro, OAC
Airoldi, C
Abstract: The interaction of copper with three different chitosans having degrees of deacetylation of 77.5, 81.5, and 86.1%, named C, A, and F, respectively, was followed by the batch method at 298 +/- 1 K and the values obtained were fitted to a modified Langmuir equation. These interactions were also obtained by calorimetric titration. Experimentally, 50.0 mg of each chitosan was suspended in doubly distilled water at 298.15 +/- 0.02 K under mechanical turbine stirring. The titration was performed by adding increments of 10 mul of a 0.10 mol dm(3) Cu(NO3)(2) aqueous solution and the calorimetric isotherms obtained were adjusted to a modified Langmuir equation. From the net thermal effects K and DeltaH values were calculated, also permitting the acquisition of other thermodynamic data for the chitosan-copper interaction at the solid/liquid interface. The exothermic enthalpic values of -45.65 +/- 1.97, -49.91 +/- 1.57, and -48.64 +/- 0.82 kJ mol(-1), for chitosans C, A, and F, respectively, reflect the degree of deacetylation. The spontaneity of the systems is shown by the negative DeltaG values, -36.1 +/- 0.2, 36.8 +/- 0.1, and -38.1 +/- 0.3 kJ mol(-1) for the same sequence of chitosans. The negative entropic values, -34, -44, and -35 J mol(-1) K-1, are in agreement with an ordering of solvent as the complexation occurred. The intensity of the thermal effects and the thermodynamic data obtained from the copper/chitosan interactions can be associated with the ability of these biopolymers to extract copper from aqueous solutions. (C) 2004 Elsevier Inc. All rights reserved.
Subject: chitosan
degree of acetylation
Country: EUA
Editor: Academic Press Inc Elsevier Science
Citation: Journal Of Colloid And Interface Science. Academic Press Inc Elsevier Science, v. 282, n. 1, n. 32, n. 37, 2005.
Rights: fechado
Identifier DOI: 10.1016/j.jcis.2004.08.165
Date Issue: 2005
Appears in Collections:Unicamp - Artigos e Outros Documentos

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