Please use this identifier to cite or link to this item:
|Type:||Artigo de periódico|
|Title:||Globular-to-needle Zn-rich phase transition during transient solidification of a eutectic Sn-9%Zn solder alloy|
|Abstract:||The aim of this article was to investigate the microstructural evolution of a eutectic Sn-9%Zn solder alloy as a function of growth rate during transient unidirectional solidification. it was found that globular-like and needle-like Zn-rich phases prevail at growth rates ranging from 0.5 to 2 mm/s and 0.3 to 0.1 mm/s, respectively, with a transition region occurring between these growth rate ranges. The microstructure control in soldering processes can be accomplished by manipulating solidification processing variables such as the cooling rate and the growth rate, since the resulting morphological microstructure depends on heat transfer conditions imposed by solidification, and as a direct consequence will affect the final properties. (C) 2009 Elsevier B.V. All rights reserved.|
|Editor:||Elsevier Science Bv|
|Citation:||Materials Letters. Elsevier Science Bv, v. 63, n. 15, n. 1314, n. 1316, 2009.|
|Appears in Collections:||Unicamp - Artigos e Outros Documentos|
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.