Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/65140
Type: Artigo de periódico
Title: Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution
Author: Osorio, WR
Freitas, ES
Spinelli, JE
Garcia, A
Abstract: Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn-Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 degrees C It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (i(corr)) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on i(corr), is also discussed. (C) 2013 Elsevier Ltd. All rights reserved.
Subject: Tin
Solder
EIS
Polarization
Corrosion
Metallurgy
Country: Inglaterra
Editor: Pergamon-elsevier Science Ltd
Rights: fechado
Identifier DOI: 10.1016/j.corsci.2013.11.010
Date Issue: 2014
Appears in Collections:Unicamp - Artigos e Outros Documentos

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.