Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/53501
Type: Artigo de periódico
Title: Mechanical properties of Sn-Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology
Author: Osorio, WR
Leiva, DR
Peixoto, LC
Garcia, LR
Garcia, A
Abstract: The aim of this experimental investigation is to evaluate the tensile properties of as-cast Sn-Ag alloys as a function of both the resulting secondary dendritic arm spacings and the morphology of the Ag3Sn IMC (intermetallic compound). This comparative experimental investigation was carried out with a view to assess the application of Sn-Ag alloys as alternative solder materials. A directional water-cooled solidification apparatus was used to obtain the as-cast samples. The resulting microstructures, ultimate and yield tensile strengths and elongation of Sn-2 wt.% Ag and Sn-3.5 wt.% Ag alloys were experimentally determined and compared with the corresponding results of the traditional Sn-40 wt.% Pb solder alloy. It was found that the Sn-Ag alloys examined comply with the compromise between compatible mechanical strength and environmental protection. (C) 2013 Elsevier B. V. All rights reserved.
Subject: Sn-Ag solder alloys
Ag3Sn
Mechanical properties
Cooling rate
Solidification
Country: Suíça
Editor: Elsevier Science Sa
Rights: fechado
Identifier DOI: 10.1016/j.jallcom.2013.02.050
Date Issue: 2013
Appears in Collections:Artigos e Materiais de Revistas Científicas - Unicamp

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