Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/355872
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dc.contributor.CRUESPUNIVERSIDADE ESTADUAL DE CAMPINASpt_BR
dc.contributor.authorunicampOliveira, Dayane Carvalho Ramos Salles de-
dc.contributor.authorunicampSinhoreti, Mário Alexandre Coelho-
dc.typeArtigopt_BR
dc.titleInfluence of thermomechanical fatigue on bond strength of repaired compositespt_BR
dc.contributor.authorda Silva, Bruno Rodrigues-
dc.contributor.authorSilva Sousa, Ana Beatriz-
dc.contributor.authorRamos Salles de Oliveira, Dayane Carvalho-
dc.contributor.authorMartins Giamatei Contente, Marta Maria-
dc.contributor.authorAlandia-Roman, Carla Cecilia-
dc.contributor.authorCoelho Sinhoreti, Mario Alexandre-
dc.contributor.authorPanzeri Pires-de-Souza, Fernanda de Carvalho-
dc.subjectResinas compostaspt_BR
dc.subject.otherlanguageComposite resinspt_BR
dc.description.abstractObjective: The aim of this study was to evaluate the influence of thermomechanical fatigue (TMF) and two adhesive systems on bond strength (BS) of repaired nanofilled composite. Materials and Methods: A hundred test specimens (8 mm diameter x 8 mm thickness) were obtained (Filtek Z350, 3M ESPE, St. Paul, MN, USA) and separated in 10 groups (n=10), according to the type of adhesive system for repair and TMF, after and before repair. Control groups: G1 - without repair and TMF (control); G2 - without repair+TMF. Groups repaired with total-etch adhesive system (ASB - Adper Scotchbond Multi-Purpose, 3M ESPE): G3 - repaired without TMF; G4 - TMF before repair; G5 - TMF after repair; G6 - TMF before and after repair. Groups repaired with self-etch adhesive system (CLB - Clearfil Liner bond 2V, Kuraray Dental): G7 - repaired without TMF; G8 -TMF before repair; G9 - TMF after repair; G10 - TMF before and after repair. After treatments, sticks (1 mm(2)) were obtained and submitted to the microtensile test (0.5 mm/mm). Failure modes were observed in Scanning Electron Microscopy (SEM-Jeol JSM 5600LV). Results: Statistical analysis (2-way ANOVA, Tukey, p <0.05) demonstrated that G2 presented highest BS values that differed statistically compared with those of other repaired groups submitted to TMF (p <0.05). Regarding control groups, G2 presented the highest BS values, different from Cl (p=0.0087). Fractographic analysis demonstrated that all repaired groups showed predominantly adhesive failures regardless of the adhesive system used. Conclusions: The TMF can improve the BS of repaired composites mainly when used self-etch adhesive, which demonstrated higher BS. The timing of TMF influences the BS of the repair on compositept_BR
dc.relation.ispartofInternational journal of adhesion and adhesivespt_BR
dc.publisher.cityLondonpt_BR
dc.publisher.countryReino Unidopt_BR
dc.publisherElsevierpt_BR
dc.date.issued2015-
dc.date.monthofcirculationSep.pt_BR
dc.language.isoengpt_BR
dc.description.volume61pt_BR
dc.description.firstpage65pt_BR
dc.description.lastpage70pt_BR
dc.rightsFechadopt_BR
dc.sourceWOSpt_BR
dc.identifier.issn0143-7496pt_BR
dc.identifier.eissn1879-0127pt_BR
dc.identifier.doi10.1016/j.ijadhadh.2015.05.005pt_BR
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S0143749615000767pt_BR
dc.description.sponsorshipFUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESPpt_BR
dc.description.sponsordocumentnumber2012/09397-8pt_BR
dc.date.available2021-02-16T10:29:47Z-
dc.date.accessioned2021-02-16T10:29:47Z-
dc.description.provenanceSubmitted by Sanches Olivia (olivias@unicamp.br) on 2021-02-16T10:29:47Z No. of bitstreams: 0en
dc.description.provenanceMade available in DSpace on 2021-02-16T10:29:47Z (GMT). No. of bitstreams: 0 Previous issue date: 2015en
dc.identifier.urihttp://repositorio.unicamp.br/jspui/handle/REPOSIP/355872-
dc.contributor.departmentsem informaçãopt_BR
dc.contributor.departmentDepartamento de Odontologia Restauradorapt_BR
dc.contributor.unidadeFaculdade de Odontologia de Piracicabapt_BR
dc.contributor.unidadeFaculdade de Odontologia de Piracicabapt_BR
dc.subject.keywordTotal-etch adhesivept_BR
dc.subject.keywordMicro-tensilept_BR
dc.subject.keywordFatiguept_BR
dc.subject.keywordRepairpt_BR
dc.subject.keywordThermocyclingpt_BR
dc.identifier.source000358457600007pt_BR
dc.creator.orcid0000-0003-1420-5720pt_BR
dc.creator.orcid0000-0002-1932-2902pt_BR
dc.type.formArtigopt_BR
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