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|Title:||Influence of photo-curing distance on bond strength and nanoleakage of self-etching adhesive bonds to enamel and dentin|
|Author:||Prieto, L. T.|
de Araujo, C. T. P.
Souza, E. J.
Lima, A. F.
Paulillo, L. A. M. S.
Dias, C. T. S.
|Abstract:||To assess the influence of light-curing unit tip distance on the microtensile bond strength (mu TBS) and nanoleakage of self-etching adhesives to enamel and dentin. Materials and methods. Flat buccal surfaces were prepared on 198 bovine incisors. The teeth were randomly assigned into nine groups for mu TBS (n = 8) and nanoleakage (n = 3) testing according to the adhesive system (Clearfil Protect Bond, Clearfil Tri-S Bond or One Up Bond F Plus) and distance from the light-curing tip (0, 3 or 6 mm). The bonded samples were tested in tension (0.5 mm/min) and nanoleakage was analyzed using SEM. Clearfil Protect Bond exhibited the highest tensile strength on both enamel and dentin. Leakage was higher in samples exposed at a distance of 6 mm on enamel and 0 mm on dentin. One Up Bond F Plus experienced the greatest amount of nanoleakage on both substrates. Light-curing unit distance did not influence the mu TBS of the adhesives, but nanoleakage increased on enamel samples when photoactivation occurred at a distance of 6 mm|
|Editor:||Taylor & Francis|
|Appears in Collections:||FOP - Artigos e Outros Documentos|
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