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dc.contributor.CRUESPUNIVERSIDADE ESTADUAL DE CAMPINASpt_BR
dc.contributor.authorunicampCampo, Kaio Niitsu-
dc.contributor.authorunicampFreitas, Caio Chaussê de-
dc.contributor.authorunicampFanton, Leonardo-
dc.contributor.authorunicampCaram Junior, Rubens-
dc.typeArtigopt_BR
dc.titleMelting behavior and globular microstructure formation in semi-solid CoCrCuxFeNi high-entropy alloyspt_BR
dc.contributor.authorCampo, Kaio Niitsu-
dc.contributor.authorFreitas, Caio Chaussê de-
dc.contributor.authorFanton, Leonardo-
dc.contributor.authorCaram, Rubens-
dc.subjectLigas (Metalurgia)pt_BR
dc.subjectMicroestruturapt_BR
dc.subject.otherlanguageAlloyspt_BR
dc.subject.otherlanguageMicrostructurept_BR
dc.description.abstractHigh-entropy alloys can be compelling raw materials for semi-solid applications. In the present study, the influence of the Cu content on the melting behavior and semi-solid microstructure of CoCrCuxFeNi (x = 0, 1, 2, 3) alloys was investigated. Arc-melted samples were cross-rolled at room temperature and then isothermally treated at 1175 °C in the semi-solid state for 300 s. Microstructural characterization showed that the alloys containing Cu were formed by two fcc phases. Notably, the increase in Cu content also led to an increase in the volumetric fraction of the Cu-rich phase. During solidification, this phase, which is the last to form, nucleates and epitaxially grows on the Cu-lean phase. All the studied CoCrCuFeNi alloys exhibited the same melting behavior. The Cu-rich phase melts at approximately 1120 °C, whereas the Cu-lean phase melts at approximately 1350 °C, providing a suitable processing temperature range of more than 200 °C. The semi-solid microstructures were considerably refined and globular regardless of the alloy composition, being suitable for semi-solid processing. Furthermore, each fcc phase exhibited roughly the same composition under the different processing conditions. The Cu content in the Cu-lean phase was approximately 10 at.%, while Co, Cr, Fe, and Ni were in an approximately equiatomic ratio. Meanwhile, the Cu content was between 80 at.% and 86 at.% in the Cu-rich phase. The isothermal treatment of the CoCrCu3FeNi alloy at a higher temperature (1300 °C) only caused the globules to coarsen. In conclusion, this work showed that these alloys can be potential candidates for semi-solid processingpt_BR
dc.relation.ispartofJournal of materials science & technologypt_BR
dc.publisher.cityLiaoningpt_BR
dc.publisher.countryChinapt_BR
dc.publisherElsevierpt_BR
dc.date.issued2020-
dc.date.monthofcirculationSept.pt_BR
dc.language.isoengpt_BR
dc.description.volume52pt_BR
dc.description.firstpage207pt_BR
dc.description.lastpage217pt_BR
dc.rightsFechadopt_BR
dc.sourceWOSpt_BR
dc.identifier.issn1005-0302pt_BR
dc.identifier.eissn1941-1162pt_BR
dc.identifier.doi10.1016/j.jmst.2020.04.009pt_BR
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S1005030220303042pt_BR
dc.description.sponsorshipFUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESPpt_BR
dc.description.sponsordocumentnumber2018/10190-5pt_BR
dc.date.available2020-10-05T20:15:03Z-
dc.date.accessioned2020-10-05T20:15:03Z-
dc.description.provenanceSubmitted by Susilene Barbosa da Silva (susilene@unicamp.br) on 2020-10-05T20:15:03Z No. of bitstreams: 0. Added 1 bitstream(s) on 2021-01-07T20:40:30Z : No. of bitstreams: 1 000544218600020.pdf: 5953739 bytes, checksum: 5cb2cabb04c85c4dedddf8d9aea9fe0e (MD5) Bitstreams deleted on 2021-01-08T14:10:39Z: 000544218600020.pdf,. Added 1 bitstream(s) on 2021-01-08T14:14:05Z : No. of bitstreams: 1 000544218600020.pdf: 5953739 bytes, checksum: 5cb2cabb04c85c4dedddf8d9aea9fe0e (MD5) Bitstreams deleted on 2021-01-13T13:27:23Z: 000544218600020.pdf,. Added 1 bitstream(s) on 2021-01-13T13:29:49Z : No. of bitstreams: 1 000544218600020.pdf: 5953741 bytes, checksum: 4e70bb755e961a601e0fbb6aa951c7df (MD5)en
dc.description.provenanceMade available in DSpace on 2020-10-05T20:15:03Z (GMT). No. of bitstreams: 0 Previous issue date: 2020en
dc.identifier.urihttp://repositorio.unicamp.br/jspui/handle/REPOSIP/350557-
dc.contributor.departmentSem informaçãopt_BR
dc.contributor.departmentSem informaçãopt_BR
dc.contributor.departmentSem informaçãopt_BR
dc.contributor.departmentDepartamento de Engenharia de Manufatura e Materiaispt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.subject.keywordSemi-solid processingpt_BR
dc.subject.keywordThixoformingpt_BR
dc.identifier.source000544218600020pt_BR
dc.creator.orcidSem informaçãopt_BR
dc.creator.orcidSem informaçãopt_BR
dc.creator.orcid0000-0001-6801-7798pt_BR
dc.creator.orcid0000-0001-6996-5116pt_BR
dc.type.formArtigo originalpt_BR
dc.description.sponsorNoteThis work was financially supported by the São Paulo Research Foundation (FAPESP) (No. 2018/10190-5). The authors also acknowledge the Brazilian Nanotechnology National Laboratory (LME/LNNano/CNPEM) for providing access to the SEM facilitiespt_BR
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