Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/344060
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dc.contributor.CRUESPUNIVERSIDADE ESTADUAL DE CAMPINASpt_BR
dc.contributor.authorunicampOsorio, Wislei Riuper Ramos-
dc.contributor.authorunicampFreitas Feitosa, Emmanuelle Sá-
dc.contributor.authorunicampGarcia, Amauri-
dc.typeArtigopt_BR
dc.titleElectrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solutionpt_BR
dc.contributor.authorOsório, Wislei R.-
dc.contributor.authorFreitas, Emmanuelle S.-
dc.contributor.authorSpinelli, José E.-
dc.contributor.authorGarcia, Amauri-
dc.subjectCorrosãopt_BR
dc.subject.otherlanguageCorrosionpt_BR
dc.description.abstractElectrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn–Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 °C. It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (icorr) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on icorr is also discussedpt_BR
dc.relation.ispartofCorrosion sciencept_BR
dc.publisher.cityOxfordpt_BR
dc.publisher.countryReino Unidopt_BR
dc.publisherElsevierpt_BR
dc.date.issued2014-
dc.date.monthofcirculationMar.pt_BR
dc.language.isoengpt_BR
dc.description.volume80pt_BR
dc.description.firstpage71pt_BR
dc.description.lastpage81pt_BR
dc.rightsFechadopt_BR
dc.sourceSCOPUSpt_BR
dc.identifier.issn0010-938Xpt_BR
dc.identifier.eissn1879-0496pt_BR
dc.identifier.doi10.1016/j.corsci.2013.11.010pt_BR
dc.identifier.urlhttps://www.sciencedirect.com/science/article/pii/S0010938X13004927pt_BR
dc.description.sponsorshipCONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQpt_BR
dc.description.sponsorshipFUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESPpt_BR
dc.description.sponsordocumentnumberNão tempt_BR
dc.description.sponsordocumentnumber2013/15478-3pt_BR
dc.date.available2020-07-01T17:19:12Z-
dc.date.accessioned2020-07-01T17:19:12Z-
dc.description.provenanceSubmitted by Susilene Barbosa da Silva (susilene@unicamp.br) on 2020-07-01T17:19:12Z No. of bitstreams: 0en
dc.description.provenanceMade available in DSpace on 2020-07-01T17:19:12Z (GMT). No. of bitstreams: 0 Previous issue date: 2014en
dc.identifier.urihttp://repositorio.unicamp.br/jspui/handle/REPOSIP/344060-
dc.contributor.departmentSem informaçãopt_BR
dc.contributor.departmentSem informaçãopt_BR
dc.contributor.departmentDepartamento de Engenharia de Manufatura e Materiaispt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.subject.keywordTinA.pt_BR
dc.subject.keywordSolderpt_BR
dc.subject.keywordPolarizationpt_BR
dc.subject.keywordMetallurgypt_BR
dc.identifier.source2-s2.0-84891628262pt_BR
dc.creator.orcid0000-0002-2754-9584pt_BR
dc.creator.orcidSem informaçãopt_BR
dc.creator.orcid0000-0002-3834-3258pt_BR
dc.type.formArtigopt_BR
dc.description.sponsorNoteThe authors acknowledge the financial support provided by CNPq (The Brazilian Research Council), FAEPEX–UNICAMP and FAPESP (São Paulo Research Foundation – Grant 2013/15478-3)pt_BR
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