Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/344060
Type: Artigo
Title: Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution
Author: Osório, Wislei R.
Freitas, Emmanuelle S.
Spinelli, José E.
Garcia, Amauri
Abstract: Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn–Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 °C. It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (icorr) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on icorr is also discussed
Subject: Corrosão
Country: Reino Unido
Editor: Elsevier
Rights: Fechado
Identifier DOI: 10.1016/j.corsci.2013.11.010
Address: https://www.sciencedirect.com/science/article/pii/S0010938X13004927
Date Issue: 2014
Appears in Collections:FEM - Artigos e Outros Documentos

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