Please use this identifier to cite or link to this item:
|Title:||Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution|
|Author:||Osório, Wislei R.|
Freitas, Emmanuelle S.
Spinelli, José E.
|Abstract:||Electrochemical impedance spectroscopy (EIS), potentiodynamic polarization techniques and an equivalent circuit analysis are used to evaluate the electrochemical corrosion behavior of Sn–Cu alloy samples in a naturally aerated 0.5 M NaCl solution at 25 °C. It has been found that a better electrochemical corrosion resistance is provided by a coarser cellular microstructure array. It has also been found that the corrosion current density (icorr) is of about a quarter when compared with that of the finest microstructure examined. Such behavior is attributed to both localized strains between the Sn-rich phase and intermetallic (IMC) particles and the cathode/anode area ratios. The effect of copper alloying on icorr is also discussed|
|Appears in Collections:||FEM - Artigos e Outros Documentos|
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.