Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/342711
Type: Artigo
Title: Solvent degradation and polymerization shrinkage reduction of resin composites using isobornyl methacrylate
Author: Favarão, Jamille
Oliveira, Dayane Carvalho Ramos Salles de
Rocha, Mateus Garcia
Zanini, Maurício Matté
Abuna, Gabriel Flores
Mendonça, Marcio José
Sinhoreti, Mário Alexandre Coelho
Abstract: The aim of this study was to use the isobornyl methacrylate (IBOMA) as a combining or substituent diluent monomer in the resin matrix of dental resin composites. Thus, the resin matrix was formulated with 60 wt% of BisGMA and 40 wt% of diluent monomers. TEGDMA as the only diluent monomer was used as control with 40 wt%, while total substitution of TEGDMA was done with 40 wt% of IBOMA. The combination of IBOMA and TEGDMA was done with 20 wt% of each monomer. To the resin matrix, 65 wt% of filler particles was added. Degree of conversion (DC) using FT-IR, flexural strength (FS), flexural modulus (FM), polymerization shrinkage by gap formation (GF), Knoop hardness (KH) and solvent degradation (SD) were evaluated. Data were analyzed using ANOVA and Tukey’s test (α=0.05; b=0.2). The results showed that reducing or substituting TEGDMA using IBOMA did not affect the DC (0.085), FS (p=0.886) or FM (p=0.414). Also, when IBOMA was used, lower GF was found in comparison to the control containing only TEGDMA as the diluent monomer (p=0.032). However, even though all composites presented reduction in KH during the SD test, the combination of IBOMA and TEGDMA showed similar reduction in KHN in comparison to the control group (p=0.001), while the total substitution of TEGDMA with IBOMA decreased KHN after SD (p=0.041). Thus, the combination of IBOMA and TEGDMA seem to reduce SD and GF without affecting the properties of resin composites
Subject: Materiais dentários
Monômeros
Metacrilatos
Country: Brasil
Editor: USP/Fundação Odontológica de Ribeirão Preto
Rights: Aberto
Identifier DOI: 10.1590/0103-6440201802525
Address: https://www.scielo.br/scielo.php?pid=S0103-64402019000300272
Date Issue: 2019
Appears in Collections:FOP - Artigos e Outros Documentos

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