Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/341856
Type: Artigo
Title: Wetting behavior of Sn–Ag–Cu and Sn–Bi–X alloys: insights into factors affecting cooling rate
Author: Silva, B.L.
Garcia, A.
Spinelli, J.E.
Abstract: Based on two experimental approaches: transient directional solidification and drop shape analyses, the measurements of cooling rates and contact angles (θ) of several solders of interest became practical. Three Sn-0.7Cu-(1; 2 and 3Ag) and four Sn-34Bi-(0Cu; 0.1Cu; 0.7Cu; 2Ag) alloys are investigated to determine their wetting behavior, compare to each other and bring to light their ability (or not) to control the initial cooling rate. In the case of SAC alloys, increase in Ag means decrease in both θ and cooling rate. An opposite correlation between cooling rate and θ is observed when Sn-34Bi and the Sn-34Bi-0.1Cu alloys are compared
Subject: Análise térmica
Country: Brasil
Editor: Elsevier
Rights: Fechado
Identifier DOI: 10.1016/j.jmrt.2018.06.016
Address: https://www.sciencedirect.com/science/article/pii/S2238785418302254
Date Issue: 2019
Appears in Collections:FEM - Artigos e Outros Documentos

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