Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/340823
Full metadata record
DC FieldValueLanguage
dc.contributor.CRUESPUNIVERSIDADE ESTADUAL DE CAMPINASpt_BR
dc.contributor.authorunicampMei, Paulo Roberto-
dc.typeArtigopt_BR
dc.titleSoldering of silicon to Invar for double-crystal monochromatorspt_BR
dc.contributor.authorBeltani Auricchio, Mayara Maria-
dc.contributor.authorMei, Paulo Roberto-
dc.contributor.authorBagnato, Osmar Roberto-
dc.subjectSilíciopt_BR
dc.subject.otherlanguageSiliconpt_BR
dc.description.abstractAt the Brazilian Synchrotron Light Laboratory (LNLS), new double-crystal monochromators are under development for use at the new Brazilian fourth-generation synchrotron, Sirius. The soldering technique used for the double-crystal monochromators ensures the union of monocrystalline silicon with FeNi alloy, Invar36 (64Fe-36Ni) from Grupo Metal and Invar39 (61Fe-39Fe) from Scientific Alloys, through SnSb (92.8Sn-7.2Sb), SnCu (Sn-0.3Cu) and SnBiCu (Sn-1.4Bi-0.7Cu) alloys from Nihon Superior. Following soldering tests and quantitative analysis, the Invar39/SnBiCu/Si samples were selected using base materials coated with different depositions - gold and copper. X-ray diffraction identified the formation of intermetallic compounds, such as AuSn2 and AuSn4 in base materials coated with gold and Cu3Sn and Cu6Sn5 with copper. Before thermal cycling, the average force obtained in shear tests was 1131N with copper deposition and 499N with gold deposition. After five consecutive thermal cycles from room temperature down to cryogenic temperature (-196.15 degrees C), specimens with gold deposition presented cracks in the interface region and those with copper deposition showed no defects. Based on this, qualitative and semi-quantitative analyses of specimens with copper deposition were carried out by scanning electron microscopy and energy-dispersive spectroscopy techniques to identify the composition, distribution and morphology of the elementspt_BR
dc.relation.ispartofJournal of synchrotron radiationpt_BR
dc.relation.ispartofabbreviationJ. synchrot. radiat.pt_BR
dc.publisher.cityChichesterpt_BR
dc.publisher.countryReino Unidopt_BR
dc.publisherWiley-Blackwellpt_BR
dc.date.issued2019-
dc.date.monthofcirculationSept.pt_BR
dc.language.isoengpt_BR
dc.description.volume26pt_BR
dc.description.issuenumber5pt_BR
dc.description.firstpage1565pt_BR
dc.description.lastpage1571pt_BR
dc.rightsFechadopt_BR
dc.sourceWOSpt_BR
dc.identifier.issn0909-0495pt_BR
dc.identifier.eissn1600-5775pt_BR
dc.identifier.doi10.1107/S1600577519008191pt_BR
dc.identifier.urlhttp://scripts.iucr.org/cgi-bin/paper?S1600577519008191pt_BR
dc.description.sponsorshipCOORDENAÇÃO DE APERFEIÇOAMENTO DE PESSOAL DE NÍVEL SUPERIOR - CAPESpt_BR
dc.description.sponsordocumentnumber88882.143464/2017-01pt_BR
dc.date.available2020-05-13T18:29:54Z-
dc.date.accessioned2020-05-13T18:29:54Z-
dc.description.provenanceSubmitted by Mariana Aparecida Azevedo (mary1@unicamp.br) on 2020-05-13T18:29:54Z No. of bitstreams: 0en
dc.description.provenanceMade available in DSpace on 2020-05-13T18:29:54Z (GMT). No. of bitstreams: 0 Previous issue date: 2019en
dc.identifier.urihttp://repositorio.unicamp.br/jspui/handle/REPOSIP/340823-
dc.contributor.departmentDepartamento de Engenharia de Materiaispt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.subject.keywordSolderingpt_BR
dc.subject.keywordInvarpt_BR
dc.subject.keywordInterfacept_BR
dc.subject.keywordAlloypt_BR
dc.identifier.source000484666200019pt_BR
dc.creator.orcid0000-0002-6150-9674pt_BR
dc.type.formArtigo de pesquisapt_BR
Appears in Collections:FEM - Artigos e Outros Documentos

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.