Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/340324
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dc.contributor.CRUESPUNIVERSIDADE ESTADUAL DE CAMPINASpt_BR
dc.contributor.authorunicampCruz, Clarissa Barros da-
dc.contributor.authorunicampLima, Thiago Soares-
dc.contributor.authorunicampGarcia, Amauri-
dc.contributor.authorunicampCheung, Noé-
dc.typeArtigopt_BR
dc.titleSn-Mg lead-free solder alloy: effect of solidification thermal parameters on microstructural features and microhardnesspt_BR
dc.contributor.authorda Cruz, Clarissa B.-
dc.contributor.authorLima, Thiago S.-
dc.contributor.authorCosta, Thiago A.-
dc.contributor.authorBrito, Crystopher-
dc.contributor.authorGarcia, Amauri-
dc.contributor.authorCheung, Noe-
dc.subjectSolda e soldagempt_BR
dc.subjectLigas (Metalurgia)pt_BR
dc.subject.otherlanguageSolder and solderingpt_BR
dc.subject.otherlanguageAlloyspt_BR
dc.description.abstractIn the last decade, several studies have been developed on lead-free alloys as potential candidates to replace Sn?Pb alloys in soldering processes. Sn?Mg alloys arise as promising alternatives due to characteristics such as low melting point, low coefficient of thermal expansion, suitable mechanical properties, electrical resistivity and low cost of Mg as an alloying element. However, the literature is scarce on studies relating the microstructure features of unsteady state cooling conditions during solidification to the resulting properties of Sn?Mg alloys. It is of the utmost importance to know the influence of the solidification cooling rate on the representative length scale of the alloy microstructure, since it varies from about 0.4 to 8 ;C s(?1) in the soldering process. In the present study the Sn 2.1 wt%Mg eutectic alloy is solidified under unsteady state conditions over a nickel substrate for a range of solidification cooling rates from 0.5 to 12 ;C s(?1). The microstructure is shown to be formed by a mixture of ??Sn and fibrous Mg2Sn intermetallics (IMC) and an experimental growth law is proposed relating the interphase spacing between Mg2Sn fibers (?(F)) and the cooling rate. With the decrease in the cooling rate a pronounced decrease in the Mg2Sn IMC fraction is shown to occur; from about 46% to 23%. Consequently, hardness, that is shown to depend on both ?(F) and Mg2Sn fraction, decreases significantly with the decrease in the solidification cooling ratept_BR
dc.relation.ispartofMaterials research expresspt_BR
dc.publisher.cityBristolpt_BR
dc.publisher.countryReino Unidopt_BR
dc.publisherInstitute of Physics Publishingpt_BR
dc.date.issued2019-
dc.date.monthofcirculationDec.pt_BR
dc.language.isoengpt_BR
dc.description.volume6pt_BR
dc.description.issuenumber12pt_BR
dc.rightsFechadopt_BR
dc.sourceWOSpt_BR
dc.identifier.eissn2053-1591pt_BR
dc.identifier.doi10.1088/2053-1591/ab58f9pt_BR
dc.identifier.urlhttps://iopscience.iop.org/article/10.1088/2053-1591/ab58f9pt_BR
dc.description.sponsorshipCONSELHO NACIONAL DE DESENVOLVIMENTO CIENTÍFICO E TECNOLÓGICO - CNPQpt_BR
dc.description.sponsorshipFUNDAÇÃO DE AMPARO À PESQUISA DO ESTADO DE SÃO PAULO - FAPESPpt_BR
dc.description.sponsordocumentnumbersem informaçãopt_BR
dc.description.sponsordocumentnumber2017/15158-0pt_BR
dc.date.available2020-05-07T14:22:59Z-
dc.date.accessioned2020-05-07T14:22:59Z-
dc.description.provenanceSubmitted by Sanches Olivia (olivias@unicamp.br) on 2020-05-07T14:22:59Z No. of bitstreams: 0. Added 1 bitstream(s) on 2020-08-27T19:17:26Z : No. of bitstreams: 1 000499907000001.pdf: 1855771 bytes, checksum: ce525ce43ac969e63e12b6417341fb48 (MD5)en
dc.description.provenanceMade available in DSpace on 2020-05-07T14:22:59Z (GMT). No. of bitstreams: 0 Previous issue date: 2019en
dc.identifier.urihttp://repositorio.unicamp.br/jspui/handle/REPOSIP/340324-
dc.contributor.departmentsem informaçãopt_BR
dc.contributor.departmentsem informaçãopt_BR
dc.contributor.departmentDepartamento de Engenharia de Manufatura e Materiaispt_BR
dc.contributor.departmentDepartamento de Engenharia de Manufatura e Materiaispt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.contributor.unidadeFaculdade de Engenharia Mecânicapt_BR
dc.subject.keywordSn-Mg alloypt_BR
dc.subject.keywordLead-free solderpt_BR
dc.subject.keywordSolidificationpt_BR
dc.subject.keywordMicrostructurept_BR
dc.subject.keywordMicrohardnesspt_BR
dc.identifier.source000499907000001pt_BR
dc.creator.orcid0000-0001-7197-7327pt_BR
dc.creator.orcidsem informaçãopt_BR
dc.creator.orcid0000-0002-3834-3258pt_BR
dc.creator.orcid0000-0003-1120-8926pt_BR
dc.type.formArtigopt_BR
dc.identifier.articleid126562pt_BR
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