Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/340211
Type: Artigo
Title: Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying al levels
Author: Lima, Thiago Soares
Silva, Bismarck Luiz
Garcia, Amauri
Cheung, Noé
Spinelli, José Eduardo
Abstract: The dependences of microstructures on the solidification thermal parameters of Sn–0.5 wt.%Cu, Sn–0.5 wt.%Cu–0.05 wt.%Al, and Sn–0.5 wt.%Cu–0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling rates and thermal gradients associated with the experiments. Various types of growth relations are proposed to represent the microstructural progresses. Al addition does not change either the matrix primary dendritic spacing or the spacing between Cu6Sn5 particles. However, it is shown that the secondary dendrite arm spacing, λ2, is greatly affected, increasing with the increase in the Al content. Both globular-type and fibrous-type morphologies typify the Cu6Sn5 intermetallics located in interdendritic zones
Subject: Solidificação
Microestrutura
Compostos intermetálicos
Eutéticos
Country: Reino Unido
Editor: Sage
Rights: Fechado
Identifier DOI: 10.1177/1464420718784314
Address: https://journals.sagepub.com/doi/full/10.1177/1464420718784314
Date Issue: Sep-2019
Appears in Collections:FEM - Artigos e Outros Documentos

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