Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/339908
Type: Artigo
Title: Slow and rapid cooling of Al-Cu-Si ultrafine eutectic composites: Interplay of cooling rate and microstructure in mechanical properties
Author: de Gouveia, Guilherme Lisboa
Kakitani, Rafael
Gomes, Leonardo Fernandes
Moreira Afonso, Conrado Ramos
Cheung, Noe
Spinelli, Jose Eduardo
Abstract: Ternary Al-15 wt% Cu-7 wt% Si and Al-22 wt% Cu-7 wt% Si alloy specimens were generated by transient directional solidification (DS) and rapid solidification (RS) techniques. The microstructures are constituted by an alpha-Al dendritic matrix surrounded by two eutectic, that is, a binary eutectic (Si + alpha-Al) and a bimodal eutectic, consisting of cellular-type binary eutectic colonies (alpha-Al + Al2Cu) in a ternary eutectic matrix consisting of alpha-Al + Al2Cu + Si. The bimodal eutectic exists at cooling rates from 0.5 to 250 K/s. The secondary dendritic spacing, lambda(2), of the DS samples varied from 5 to 20 mu m and from 10 to 18 mu m for both examined alloys. The lambda(2) from 2.7 to 4.0 mu m characterized the RS samples. Mechanical properties have been determined for various samples related to different dendritic spacing values. Based on the evaluation of the rapidly solidified microstructures, it was possible to assess the cooling rates
Subject: Metais - Processos de solidificação rapida
Microestrutura
Country: Estados Unidos
Editor: Cambridge University Press
Rights: Fechado
Identifier DOI: 10.1557/jmr.2018.495
Address: https://www.cambridge.org/core/journals/journal-of-materials-research/article/slow-and-rapid-cooling-of-alcusi-ultrafine-eutectic-composites-interplay-of-cooling-rate-and-microstructure-in-mechanical-properties/5D688A4DD7BA0C67099D2CD791DC01C6
Date Issue: 2019
Appears in Collections:FEM - Artigos e Outros Documentos

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