Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/336809
Type: Artigo
Title: Sn-Bi(-Ga) TIM alloys: microstructure, tensile properties, wettability and interfacial reactions
Author: Evangelista da Silva, Vitor Covre
de Gouveia, Guilherme Lisboa
Valenzuela Reyes, Rodrigo Andre
Garcia, Amauri
Spinelli, Jose Eduardo
Abstract: In the present study, the main purpose is to examine the quality of the interface formed between either binary Sn-Bi or ternary Sn-Bi-2wt.%Ga Thermal Interface MaterialTIM alloys and a copper (Cu) substrate. The characteristics of the formed intermetallic compound (IMC) films were analyzed in the as-soldered joints, as well as during isothermal heat treatments at 100 degrees C for long periods of time. Thermo-Calc computations were also used in return for a better comprehension of the mechanisms involved, including, for instance, those related to the presence of Ga within the interdendritic regions. This can be explained by the increase in the Ga-amount in the liquid-phase with the progress of solidification. In an effort to address the wettability issue, the contact angles between the molten alloy and the Cu substrate were also determined. Finally, tensile tests were performed in order to evaluate the effects of the minor Ga additions in the alloy's overall mechanical properties. Despite unsound alloy mechanical properties, gallium (Ga) additions effectively suppress the formation of the CuSn intermetallic by replacing it with a Cu9Ga4 IMC layer in the as-soldered material, which grew with less deleterious morphology and finer thicknesses
Subject: Ligas (Metalurgia)
Country: Estados Unidos
Editor: Springer
Rights: Fechado
Identifier DOI: 10.1007/s11664-019-07286-4
Address: https://link.springer.com/article/10.1007%2Fs11664-019-07286-4
Date Issue: 2019
Appears in Collections:FEM - Artigos e Outros Documentos

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