Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/326902
Type: Artigo
Title: Effect Of Solution Time In T6 Heat Treatment On Microstructure And Hardness Of A Directionally Solidified Al-si-cu Alloy
Author: Costa
Thiago A.; Dias
Marcelino; Gomes
Laercio G.; Rocha
Otavio L.; Garcia
Amauri
Abstract: An experimental investigation on the role of solution time during the T6 heat treatment on the scale of the secondary dendrite arm spacing (lambda(2)), morphology and distribution of Si particles and Al2Cu intermetallics and the resulting effect on microhardness of Al-5.5 wt% Si-3.0 wt% Cu alloy samples is performed. A directionally solidified (DS) casting was previously obtained using a water-cooled apparatus, which permitted a wide range of cooling rates ((T) over dot) to be associated with samples having quite different microstructural parametric features. An experimental growth law relating lambda(2) to (T) over dot is proposed. The T6 heat treatment was then carried out on the DS samples for different solution times: 8 h and 5 h at 490 +/- 2 degrees C, followed by quenching in warm water (60 +/- 2 degrees C), ageing for 5 h at 155 +/- 2 degrees C and air-cooling. The microstructure characterization (optical and scanning electron microscopies) has shown that lambda(2) was only affected (when compared with those of the DS casting samples) when the solution time increased from 5 h to 8 h. In contrast, significant influences on the morphology and distribution of both Si and Al2Cu particles are shown to occur. The highest hardness is shown to be associated with a sample subjected to the 5 h treatment, having lowest lambda(2) and appropriate modification of Si and Al2Cu particles. (C) 2016 Elsevier B.V. All rights reserved.
Subject: Al-si-cu Alloy
Solidification
Heat Treatment
Microstructure
Hardness
Editor: Elsevier Science AS
Lausanne
Rights: fechado
Identifier DOI: 10.1016/j.jallcom.2016.05.099
Address: http://www-sciencedirect-com.ez88.periodicos.capes.gov.br/science/article/pii/S0925838816314335?via%3Dihub
Date Issue: 2016
Appears in Collections:Unicamp - Artigos e Outros Documentos

Files in This Item:
File SizeFormat 
000378835200065.pdf2.69 MBAdobe PDFView/Open


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.