Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/320180
Type: Artigo de Periódico
Title: Cooling Thermal Parameters And Microstructure Features Of Directionally Solidified Ternary Sn-bi-(cu,ag) Solder Alloys
Author: Silva
BL; Garcia
A; Spinelli
JE
Abstract: Low temperature soldering technology encompasses Sn-Bi based alloys as reference materials for joints since such alloys may be molten at temperatures less than 180 degrees C. Despite the relatively high strength of these alloys, segregation problems and low ductility are recognized as potential disadvantages. Thus, for low-temperature applications, Bi-Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities. In this context, additions of third elements such as Cu and Ag may be an alternative in order to reach sounder solder joints. The length scale of the phases and their proportions are known to be the most important factors affecting the final wear, mechanical and corrosions properties of ternary Sn-Bi-(Cu,Ag) alloys. In spite of this promising outlook, studies emphasizing interrelations of microstructure features and solidification thermal parameters regarding these multicomponent alloys are rare in the literature. In the present investigation Sn-Bi-(Cu,Ag) alloys were directionally solidified (DS) under transient heat flow conditions. A complete characterization is performed including experimental cooling thermal parameters, segregation (XRF), optical and scanning electron microscopies, X-ray diffraction (XRD) and length scale of the micro structural phases. Experimental growth laws relating dendritic spacings to solidification thermal parameters have been proposed with emphasis on the effects of Ag and Cu. The theoretical predictions of the Rappaz-Boettinger model are shown to be slightly above the experimental scatter of secondary dendritic arm spacings for both ternary Sn-Bi-Cu and Sn-Bi-Ag alloys examined. (C) 2016 Elsevier Inc. All rights reserved.
Subject: Sn-bi-cu Alloys
Sn-bi-ag Alloys
Solder Alloys
Solidification
Cooling Rate
Microstructure
Editor: ELSEVIER SCIENCE INC
Rights: fechado
Identifier DOI: 10.1016/j.matchar.2016.02.002
Address: http://www-sciencedirect-com.ez88.periodicos.capes.gov.br/science/article/pii/S1044580316300274
Date Issue: 2016
Appears in Collections:Unicamp - Artigos e Outros Documentos

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