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dc.contributor.CRUESPUNIVERSIDADE DE ESTADUAL DE CAMPINASpt_BR
dc.identifier.isbn1873-4669pt
dc.typeArtigo de Periódicopt_BR
dc.titleEffect Of Solution Time In T6 Heat Treatment On Microstructure And Hardness Of A Directionally Solidified Al-si-cu Alloypt_BR
dc.contributor.authorCostapt_BR
dc.contributor.authorTA; Diaspt_BR
dc.contributor.authorM; Gomespt_BR
dc.contributor.authorLG; Rochapt_BR
dc.contributor.authorOL; Garciapt_BR
dc.contributor.authorApt_BR
unicamp.author.emailamaurig@fem.unicamp.brpt_BR
dc.subjectAl-si-cu Alloypt_BR
dc.subjectSolidificationpt_BR
dc.subjectHeat Treatmentpt_BR
dc.subjectMicrostructurept_BR
dc.subjectHardnesspt_BR
dc.description.abstractAn experimental investigation on the role of solution time during the T6 heat treatment on the scale of the secondary dendrite arm spacing (lambda(2)), morphology and distribution of Si particles and Al2Cu intermetallics and the resulting effect on microhardness of Al-5.5 wt% Si-3.0 wt% Cu alloy samples is performed. A directionally solidified (DS) casting was previously obtained using a water-cooled apparatus, which permitted a wide range of cooling rates ((T) over dot) to be associated with samples having quite different microstructural parametric features. An experimental growth law relating lambda(2) to (T) over dot is proposed. The T6 heat treatment was then carried out on the DS samples for different solution times: 8 h and 5 h at 490 +/- 2 degrees C, followed by quenching in warm water (60 +/- 2 degrees C), ageing for 5 h at 155 +/- 2 degrees C and air-cooling. The microstructure characterization (optical and scanning electron microscopies) has shown that lambda(2) was only affected (when compared with those of the DS casting samples) when the solution time increased from 5 h to 8 h. In contrast, significant influences on the morphology and distribution of both Si and Al2Cu particles are shown to occur. The highest hardness is shown to be associated with a sample subjected to the 5 h treatment, having lowest lambda(2) and appropriate modification of Si and Al2Cu particles. (C) 2016 Elsevier B.V. All rights reserved.en
dc.relation.ispartofJournal of Alloys and Compoundspt_BR
dc.publisher.cityLAUSANNEpt_BR
dc.publisherELSEVIER SCIENCE SApt_BR
dc.date.issued2016pt_BR
dc.identifier.citationJournal Of Alloys And Compounds. ELSEVIER SCIENCE SA, n. 683, p. 485 - 494.pt_BR
dc.language.isoEnglishpt_BR
dc.description.volume683pt_BR
dc.description.issuenumberpt_BR
dc.description.firstpage485pt_BR
dc.description.lastpage494pt_BR
dc.rightsfechadopt_BR
dc.sourceWOSpt_BR
dc.identifier.issn0925-8388pt_BR
dc.identifier.wosidWOS:000378835200065pt_BR
dc.identifier.doi10.1016/j.jallcom.2016.05.099pt_BR
dc.identifier.urlhttp://www-sciencedirect-com.ez88.periodicos.capes.gov.br/science/article/pii/S0925838816314335pt_BR
dc.description.sponsorshipIFPA (Federal Institute of Education, Science and Technology of Para)pt_BR
dc.description.sponsorshipFAPESP - Sao Paulo Research Foundation, Brazil [2013/09267-0, 2013/23396-7, 2014/50502-5]pt_BR
dc.description.sponsorshipCNPq (The Brazilian Research Council)pt_BR
dc.description.sponsorship1Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)pt_BR
dc.description.sponsorship1Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)pt_BR
dc.date.available2016-12-06T18:30:40Z-
dc.date.accessioned2016-12-06T18:30:40Z-
dc.description.provenanceMade available in DSpace on 2016-12-06T18:30:40Z (GMT). No. of bitstreams: 1 000378835200065.pdf: 2753137 bytes, checksum: df0aeacdc1b061057c6d86b93d72b308 (MD5) Previous issue date: 2016en
dc.identifier.urihttp://repositorio.unicamp.br/jspui/handle/REPOSIP/320091-
dc.description.conferencelocationpt_BR
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