Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/242128
Type: Artigo de periódico
Title: Evaluation Of Solder/substrate Thermal Conductance And Wetting Angle Of Sn-0.7 Wt%cu-(0-0.1 Wt%ni) Solder Alloys
Author: Silva
Bismarck Luiz; Cheung
Noe; Garcia
Amauri; Spinelli
Jose Eduardo
Abstract: Wettability is defined as the tendency of a liquid metal to spread on a solid surface. The solder/substrate thermal conductance represented by a heat transfer coefficient, h(i), states the heat ability to flow across the solder/substrate interface during solidification, being affected by the wettability. This letter aims to investigate the wetting behavior of Sn-0.7 wt%Cu-(Ni) lead-free solders by measuring the contact angles (theta) on a copper substrate as a function of the alloy Ni content. Furthermore, time-dependent h(i) profiles are determined from thermal readings during directional solidification (DS) of Sn-0.7 wt%Cu-(xNi) alloys. It is shown that a smaller initial contact angle (theta(i)=32.7) characterizes the Sn-0.7 wt%Cu-0.05 wt%Ni associated with the highest h(i) value of 11,500t(-032.7) w/m(2) K A (t: time). (C) 2014 Elsevier B.V. All rights reserved.
Subject: Transient Directional Solidification
Mechanical-properties
Cu Substrate
Microstructure
Ni
Country: AMSTERDAM
Editor: ELSEVIER SCIENCE BV
Rights: embargo
Identifier DOI: 10.1016/j.matlet.2014.11.088
Address: http://www.sciencedirect.com/science/article/pii/S0167577X1402076X
Date Issue: 2015
Appears in Collections:Unicamp - Artigos e Outros Documentos

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