Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/105588
Type: Artigo de evento
Title: Electroless Deposited Nickel Hard Mask For High Density Plasma Etching Applications
Author: Nunes A.M.
Moshkalev S.A.
Flacker A.
Tatsch P.I.
Besseler E.
Abstract: Ni electroless films were used as a material for hard mask during highdensity ICP plasma etching. The results have shown that under the plasma exposure strong hardening of the mask occurs and the rate of Ni film removal falls at least an order of magnitude as compared with its initial value. Therefore, very high selectivities for Si etching over Ni are obtained, allowing for very deep etching required for some MEMS applications. © The Electrochemical Society.
Editor: 
Rights: fechado
Identifier DOI: 10.1149/1.2956055
Address: http://www.scopus.com/inward/record.url?eid=2-s2.0-57749177422&partnerID=40&md5=b63a46c73ce3e510491a8093a14a6ee3
Date Issue: 2008
Appears in Collections:Unicamp - Artigos e Outros Documentos

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