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|Type:||Artigo de evento|
|Title:||Electroless Deposited Nickel Hard Mask For High Density Plasma Etching Applications|
|Abstract:||Ni electroless films were used as a material for hard mask during highdensity ICP plasma etching. The results have shown that under the plasma exposure strong hardening of the mask occurs and the rate of Ni film removal falls at least an order of magnitude as compared with its initial value. Therefore, very high selectivities for Si etching over Ni are obtained, allowing for very deep etching required for some MEMS applications. © The Electrochemical Society.|
|Appears in Collections:||Unicamp - Artigos e Outros Documentos|
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