Please use this identifier to cite or link to this item: http://repositorio.unicamp.br/jspui/handle/REPOSIP/102554
Type: Artigo de evento
Title: Liga Technology - Cu, Au And Ni Electroforming
Author: Maia I.A.
Ferreira L.O.S.
De Oliveira Piazzetta M.H.
Natal G.C.
Filho J.R.
Abstract: The objective of the present work is to present and discuss th delamination problem found in running the Multiuser Project (MUSA 2000 -Copper) where copper microstructures of different sizes and shapes and for various applications are electroformed together, on a same substrate, using LIGA technology. Delamination occurred when copper layers (40-50 μm) were electroformed using commercial bath on substrates having conductive thin films deposited on thick (1 μm) thermally grown silicon oxide layers (TTGSOL) Delamination was prevented by replacing commercial bath by homemade bath or by sending samples to be electroformed in an industry. This is an exploratory work that will be useful in a further refinement work. Few nickel electroforming experiments suggest the existence of the same problems and solutions found in the copper experiments. Gold electroforming was performed to produce absorbers for X-ray masks. The hole of the polymeric mold used in the electroforming work was also evaluated. The studies of mold performance, evaluated in terms of microstructure lateral resolution and mold removal after electroforming, revealed that a new photo-polymer should be found to meet the stringent X-ray mask requirements.
Editor: 
Rights: fechado
Identifier DOI: 
Address: http://www.scopus.com/inward/record.url?eid=2-s2.0-1842525736&partnerID=40&md5=ae84f8e8166760a020f0137fc3fc6d1d
Date Issue: 2003
Appears in Collections:Unicamp - Artigos e Outros Documentos

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