Browsing by Author Cheung N.

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PreviewIssue DateTitleAuthor(s)AdvisorType
2005Numerical And Experimental Analysis Of Laser Surface Remelting Of Al- 15cu Alloy SamplesCheung N.; Pinto M.A.; Ierardi M.C.F.; Garcia A.-Artigo de evento
2009Numerical Simulation And Experimental Analysis Of Laser Surface Remelting Of Aisi 420 Stainless Steel SamplesCheung N.; Larosa M.A.; Osorio W.R.; Lerardi M.C.F.; Garcia A.-Artigo de evento
2009Mathematical Modeling Of Mold-filling And Solidification Of Castings: Part Ii - Application To A Cu 5%zn Alloy Casting In A Sand Mold [matematické Modelovanie Plnenia Formy A Tuhnutia Odliatkov časť Ii - Aplikácia S Použitím Zliatiny Cu-5%zn]Pariona M.M.; Bertelli F.; Cheung N.; Garcia A.-Artigo de periódico
2009Mathematical Modeling Of Mold-filling And Solidification Of Castings: Part I - Theoretical Basis [matematické Modelovanie Plnenia Formy A Tuhnutia Odliatkov: Časť I - Teoretické Základy]Pariona M.M.; Bertelli F.; Cheung N.; Garcia A.-Artigo de periódico
2009Corrigendum To "cellular Growth During Transient Directional Solidification Of Hypoeutectic Al-fe Alloys" [j. Alloys Compd. 470 (2009) 589-599] (doi:10.1016/j.jallcom.2008.03.026)Goulart P.R.; Cruz K.S.; Spinelli J.E.; Ferreira I.L.; Cheung N.; Garcia A.-Errata
2011Laser Remelting Of Al1.5 Wt%fe Alloy Surfaces: Numerical And Experimental AnalysesBertelli F.; Meza E.S.; Goulart P.R.; Cheung N.; Riva R.; Garcia A.-Artigo de periódico
2015Sn-0.7 Wt%cu-(xni) Alloys: Microstructure-mechanical Properties Correlations With Solder/substrate Interfacial Heat Transfer CoefficientSilva B.L.; Cheung N.; Garcia A.; Spinelli J.E.-Artigo de periódico
2015High Cooling Rate Cells, Dendrites, Microstructural Spacings And Microhardness In A Directionally Solidified Al-mg-si AlloyBrito C.; Reinhart G.; Nguyen-Thi H.; Mangelinck-Noel N.; Cheung N.; Spinelli J.E.; Garcia A.-Artigo de periódico
2015Experimental And Numerical Analyses Of Laser Remelted Sn–0.7 Wt%cu Solder SurfacesSilva B.L.; Spinelli J.E.; Cante M.V.; Bertelli F.; Cheung N.; Riva R.; Garcia A.-Artigo de periódico
2014The Use Of A Directional Solidification Technique To Investigate The Interrelationship Of Thermal Parameters, Microstructure And Microhardness Of Bi-ag Solder AlloysSpinelli J.E.; Silva B.L.; Cheung N.; Garcia A.-Artigo de periódico
2013Effect Of Mold Surface Roughness On The Interfacial Heat Transfer Coefficient During Solidification Of Solder AlloysDias A.C.P.; Meza E.S.; Bertelli F.; Goulart P.R.; Cheung N.; Garcia A.-Artigo de evento
2013Heat Transfer Characteristics Of Inward, Outward And Upward Solidification Of An Al-1.5wt%fe Alloy In Cylindrical Chill MoldsBertelli F.; Meza E.S.; Bezerra J.D.; Goulart P.R.; Cheung N.; Garcia A.-Artigo de evento
2013Unsteady-state Directional Solidification Of A Hypoperitectic Pb-9.5wt%bi AlloyCastanho M.A.P.; Goulart P.R.; Cheung N.; Garcia A.-Artigo de evento
2013Assessment Of Cooling Conditions Of A Continuous Casting Machine For Steel Billets Based On Surface Temperature MeasurementsCheung N.; Taconi L.; Garcia A.-Artigo de evento
2008Microstructural Modification By Laser Surface Remelting And Its Effect On The Corrosion Resistance Of An Al-9 Wt%si Casting AlloyOsorio W.R.; Cheung N.; Spinelli J.E.; Cruz K.S.; Garcia A.-Artigo de periódico
2015Steady And Unsteady State Peritectic SolidificationCastanho M.A.P.; Goulart P.R.; Brito C.; Spinelli J.E.; Cheung N.; Garcia A.-Artigo de periódico
2015Cooling Thermal Parameters, Microstructure, Segregation And Hardness In Directionally Solidified Al-sn-(si;cu) AlloysBertelli F.; Brito C.; Ferreira I.L.; Reinhart G.; Nguyen-Thi H.; Mangelinck-Noel N.; Cheung N.; Garcia A.-Artigo de periódico
2011Influence Of Solidification Microstructure On The Wear Resistance Of Al-si And Al-sn Alloys Directionally Solidified Under Unsteady State Conditions.Sabat K.; Cheung N.; Spinelli J.E.; Casteletti L.C.; Garcia A.-Capítulo de livro
2004Correlation Between Structure Of Solidification And Resulting Properties [correlaç̃o Entre Estrutura De Solidificação E Propriedades Decorrentes]Cheung N.; Garcia A.-Artigo de periódico
2013Microstructure And Mechanical Properties Of Directionally Solidified Unmodified And Ni-modified Sn-0.7wt%cu Lead-free Solder AlloyCheung N.; Garcia A.; Spinelli J.E.-Artigo de periódico